Interposer Canvas

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Interposer Canvas
Features
  • Solderable prototyping surface wired as one small solderless breadboard with power rail
  • Breakout connections for V+, V-,GND, +12V, -12V, +5V, and +3.3V.
  • LEDIndicators for power supply status
  • USB header for connection to FPGA board
Dimensions
Width
5 in
Height
7.3 in
Product Compliance
HTC
8537109170
ECCN
EAR99

The Interposer Canvas is a replaceable and removable prototyping surface intended for using the Analog Discovery Studio with FPGA development boards. The Interposer Canvas provides a 150-position solderless breadboard and a power rail for prototyping additional circuits. There is also a small breakout board for V+, V-, +12V, -12V, +5V, +3.3V, and Ground. There are 6 greenLEDindicators to show the status of power supplies.



Documentation

Tutorials

Additional Resources

Interposer Canvas Schematic

The Interposer Canvas features mounting holes to accommodate the following FPGA boards: